Laser Surface Engineering

We focus intense effort on laser micro-material processing using ultra-short laser pulses, covering everything from process development, to process management, to control systems.

Our research group

Our specialist field is laser micro-processing with high throughput and utmost precision on various materials.
We optimise the efficiency of processes and material removal strategies as well as beam guidance and beam formation methods. We also develop solutions for synchronisation between highly repetitive lasers (MHz range) and beam guidance and processing systems for maximum precision.

Range of services

Our expertise and infrastructure is available to external partners for student theses, research projects or joint projects funded by third parties. Please contact us if you require more details or you can find further information here:

Areas of expertise

We focus on the following key topics:

  • Material removal

We use our short (ns) and ultra-short (ps, fs) pulsed lasers to remove layers from and structure various materials, such as metals, ceramics, semi-conductors, plastics, glass and crystals. Our priority is optimising the material removal process and increasing its efficiency.

  • Surface structuring

We draw up strategies and methods for the targeted creation of surface structures with dimensions from sub-µm to the mm range.

  • Customer-specific process development

Our broad, in-depth expertise means that we can develop and implement processes specifically optimised to your application.

  • High-precision and rapid processing methods

By synchronising scanners (galvo or polygon scanners) with the laser pulse with repetition rates of up to several MHz, we achieve highest levels of precision which cannot be achieved with conventional methods. A patented technology developed in-house is deployed for galvo scanners.

  • Control and combination of axes for laser processing

In tandem with I3S, our sister institute, we combine scanner systems (galvo and polygon) with various mechanical axes  (linear and rotation axes) to optimally implement your processes. We use our own synchronisation technology for the highest level of precision.

  • Testing and analysis

We test and qualify new components (laser and beam guidance) specifically for laser micro-processing applications

  • High-temperature ellipsometry

We can measure both the refraction and absorption index of metals based on temperature from solid to liquid states.

Our climate-controlled laser lab has the following equipment in addition to the components listed separately further down:

  • Dust lock, flowbox system, power, water and gas supply (N2, argon)
  • Optical tables, optical mechanics, range of lenses, reflectors and waveplates
  • Lenses
  • Several controlled linear axes, two- and three-axis working areas and levels of precision for different systems as well as a controlled five-axis system
  • Various power meters (spectral range from 190 nm to 11 μm, power range from 10 nW to 300 W)
  • Auto-correlators for ps and fs pulse duration measurement
  • Beam-profiling systems

The main laser systems

DUETTO: Pico-second laser system (Time Bandwidth Products):

  • Output power 6 W @ 1064 nm
  • Repetition rate 50 kHz to 1 MHz
  • Pulse energy up to 200 μJ @ 1064 nm
  • Pulse duration < 12 ps
  • Wave lengths 1064 nm, 532 nm, 355 nm
  • Beam quality M2 < 1.3 (TEM00)

DUETTO Burgdorf amplifier:
Optional amplifier with pulse-picker for the DUETTO system described above. This extends the range of possible pulse energies up to 600 μJ and the pulse repetition rates from 50 kHz to single-shot operation.

FUEGO: Pico-second laser system (Time Bandwidth Products):

  • Output power 45 W @ 1064 nm
  • Repetition rate 200 kHz to 8.2 MHz
  • Pulse energy up to 200 μJ @ 1064 nm
  • Pulse duration < 10 ps
  • Wavelengths 1064 nm, 532 nm, 355 nm
  • Beam quality M2 < 1.3 (TEM00)
  • FlexBurst

PICOBALDE II: Pico-second laser system (Lumemtum):

  • Output power 50 W @ 1064 nm
  • Repetition rate 200 kHz to 8.2 MHz
  • Pulse energy up to 200 μJ @ 1064 nm
  • Pulse duration < 10 ps
  • Wave length 1064 nm
  • Beam quality M2 < 1.3 (TEM00)
  • FlexBurst
  • AccuTrig

SATSUMA HPII: Femtosecond laser system (Amplitudes Systèmes):

  • Output power 20 W @ 1030 nm
  • Repetition rate 500 kHz to 2.0 MHz
  • Pulse energy up to 40 μJ @ 1064 nm
  • Pulse duration < 350 fs
  • Wave length 1030 nm, 515 nm, 343 nm
  • Beam quality M2 < 1.3 (TEM00)
  • Pulse bursts

Other fs and ps laser systems in specific research projects:

IPG ns fibre laser @ 1064 nm
The industry-compatible, pulsed ytterbium fibre laser from IPG provides pulse energy up to 1 mJ with beam quality of M2 < 2. Eight different pulse durations are available in the ns range, enabling process optimisation and process studies.

  • Output power 20 W
  • Repetition rate 1.6 - 1000 kHz
  • Pulse energy < 1 mJ
  • Pulse duration 4, 8, 14, 20, 30, 50, 100 or 200 ns

IPG ns fibre laser @ 532 nm
The frequency-doubled, pulsed ytterbium fibre laser from IPG provides pulse energy of up to 16 μJ with beam quality of M2 < 1.2

  • Output power 5 W @ 300 kHz
  • Repetition rate 20 - 300 kHz
  • Pulse energy 16 μJ @ 300 kHz
  • Pulse duration 1.5 ns @ 300 kHz


Galvanometer scanners are ideal for surface structuring. Various intelliSCAN and excelliSCAN systems for all three wavelengths with lenses from 50 to 255 mm in focal length are used.

Polygon scanner:
Our LSE170STD polygon scanner from NextScan Technologies is available for very rapid, high-performance applications.


Contact us or meet our experts in person at various events. Collaboration produces win-win outcomes for everyone concerned – your company, society and the university.